參考價(jià)格
面議型號(hào)
工藝測(cè)試芯片品牌
華進(jìn)半導(dǎo)體產(chǎn)地
江蘇樣本
暫無規(guī)格外形(長*寬*高):
-功率(kw):
-重量(kg):
-看了工藝測(cè)試芯片的用戶又看了
虛擬號(hào)將在 180 秒后失效
使用微信掃碼撥號(hào)
1. RDL
規(guī)格書:
Item | Single Side RDL | Double Side RDL |
Min Si Thickness | 60um | 60um |
Copper Thickness | >6um | >6um |
Copper Line/Space | Min 10um/10um | Min 10um/10um |
Chip Size | Target ±20um | Target ±20um |
Min Chip Size | 0.6mm×0.3mm | 0.6mm×0.3mm |
Tape&Reel | Min die thickness 90um | Min die thickness 90um |
結(jié)構(gòu)示意圖:
2. TSV
規(guī)格書:
Item | TSV 10:100 | TSV 20:200 |
Wafer size | 300mm | 300mm |
Si Thickness | 100um±10um | 200um±10um |
Via size | 10um±1.5um | 20um±3um |
Metal layers | Top side:3 | Top side:3 |
Copper Line/Space | Min 10um/10um | Min 10um/10um |
Micro Bump Pitch | Min 40um | Min 40um |
結(jié)構(gòu)示意圖:
3. Bumping
規(guī)格書:
Item | Wafer Bumping |
Wafer Size | 300mm/200mm |
Bump Pitch | Min 80um |
Bump Size | Min 50um |
Bump Height | <80um |
RDL Line/Space | Min 10um/10um |
暫無數(shù)據(jù)!