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無鹵,高CTI,鋁基覆銅板品牌
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1. Typical value is based on specimen of 1.5mm Al/100μm dielectric/1oz Cu.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.
Items | Method | Condition | Unit | Typical Value |
---|---|---|---|---|
Thermal Conductivity | ASTM-D5470 | A | W/ (m?K) | 1.1 |
Thermal Resistance | ASTM-D5470 | A | K·cm2/W | 0.91 |
Tg | 2.4.25D | DSC | ℃ | 100 |
Td | 2.4.24.6 | Wt 5% loss | ℃ | 410 |
Thermal Stress | 2.4.13.1 | 288℃, solder float | min | 30 |
CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 27 |
After Tg | ppm/℃ | 30 | ||
50-260℃ | % | 0.74 | ||
Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 106 |
Surface Resistivity | 2.5.17.1 | C-96/35/90 | MΩ | 107 |
Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | 6.0 |
Peel Strength (1oz) | 2.4.8 | 288℃/10s | N/mm | 1.4 |
Flammability | UL94 | C-48/23/50 | Rating | V-0 |
MOT | UL | A | ℃ | 130 |
CTI | IEC60112 | A | Rating | PLC0 |
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